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SMT PRINTER STENCIL BLOCKAGE

Time:2019/05/18 丨 Source:未知 丨 Browse times:

When the SMT PRINTER machine is printed, there will sometimes be a problem that the stencil is blocked, which greatly affects the work efficiency, and the solder paste cannot be printed normally. What causes the solder paste to block the stencil? HC solder paste printing machine to share with you here.
 
 
1. The solder paste composition will change constantly during the printing process. The most obvious is the viscosity change. When the temperature is higher, the flux volatilizes faster. When the humidity is higher, the water absorption of the solder paste will be compared. Prominent, these will lead to changes in the viscosity of the solder paste, which affects its surface tension. Changes in tension can cause changes in the off-grid situation, and stencil clogging may occur.
 
2. Check whether the opening of the SMT PRINTER MACHINE solder paste stencil is reasonable, the viscosity of the selected solder paste, the size of the solder ball, the purpose, the material of the scraper, the pressure during operation, the pressure of the platen and the time of the stripping .
 
3, the temperature of the solder paste stencil and smt printing machine operation is also related, you can consider the operating environment. The 0.4pitch stencil has a small opening, and if there are many burrs on the edge of the stencil, the tin is not good and will be blocked.
 
So before the smt press is printing, we should check the following aspects:
 
1. Scraper selection: metal or rubber
2. Printing pressure
3. Speed, travel distance and position of the scraper during printing
4. Demoulding method and speed
5. Cleaning cycle: dry rub + wet rub 5pcs, etc. depending on the product
6.mark recognition method, stencil positioning
7. Test solder paste height deviation is plus or minus 20% of stencil thickness
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